1. The Low Cost Flip Chip Consortium is a recent example. 2. The object is to flip chips so that their pictures are right side up. 3. In flip chip systems the IC is connected by solder bumps to a substrate. 4. Processing a flip chip is similar to conventional IC fabrication, with a few additional steps. 5. Flip chips don't require wire bonding, but he said his wire bonding business will survive.6. He predicted that so-called " flip chip " technology " is about to take off ." 7. He said he expects flip chip equipment to become a major business for Kulick & Soffa. 8. The venture will be called Flip Chip Technologies. 9. He said he expects flip chip equipment to become a major business for Kulick & AMP; Soffa. 10. SiP solutions may require multiple packaging technologies, such as flip chip , wire bonding, wafer-level packaging and more.
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